Wednesday, 23 September 2009
Intel presses on with smaller geometry
Intel is due to start shipping commercial processor chips using a 32nm geometry size by the end of this year but is always continuing to push ahead with reductions in die size in order to push the gap further between it and its competitors. They have already demonstrated a 22nm wafer that is populated with RAM chips at a conference. It contains 2.9 billion transistors in an area the size of a fingernail. The 32nm Xeon chips which will find their way into systems during the first months of 2010 are the sort that Apple typically uses in its Pro tower models. The 22nm process should become part of standard manufacturing by the last quarter of 2011 and a move to an amazing 15nm process by 2013.